I’m trying to solder my TSSOP-16 chip to the DIP adapter. I’m planning to apply solder paste to the adapter’s pads, put the chip on the adapter and then use my kitchen oven to melt solder paste and connect those two together. I have a few questions:
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Should solder paste be precisely applied to each of adapter’s pads without going over to neighboring pad or is it okay to just smear solder paste on all pads?
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Should solder paste completely cover adapter’s pads or should i put just enough paste so that SMD chip’s leg om adapter-pad is covered?
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At what temperature and for how long should I keep this in my kitchen oven?
Here’s an image of my adapter, little smd chip and solder paste:
Best Answer
As others have said, don't use an oven that you put your food in!! Lead poisoning is no joke.
If you are looking for the easiest and cheapest way to do reflow soldering at home, I recommend getting a cheap hot air gun with adjustable airspeed and temperature control. They can be had on amazon for less than $50, and allow you to repair existing boards as well as reflow new ones.
When applying the solder paste for this package, a single thin bead vertically across all of the pads should be fine. Once you heat things up, the solder will flow to the pads and shape up nicely. If you apply too much solder, bridges will form between the pads; you can clean those up with a soldering iron and some solder wick.