Electronic – Decoupling capacitors on the bottom layer

I'm using 0.01 uF decoupling capacitors in a 0805 package, on each V_cc/GND pair of my CPLDs. So, around eight capacitors in total). I find it a bit easier to route the board if the decoupling capacitors are placed on the bottom layer and connected to the V_cc and GND pins of the CPLD/MCU using vias.

Is this a good practice? I understand the aim is to minimize the current loop between the chip and the capacitor.

My bottom layer also serves as a ground plane. (it's a two-layer board, so I don't have a V_cc plane), and so I don't need to connect the ground pin of the capacitor using vias. Obviously, the chip's GND pin is connected using a via. Here's a picture that illustrates this better:

The thick trace coming toward the capacitor is V_cc (3.3 V) and it's connected to another thick trace that comes straight from the power source. I provide V_cc to all the capacitors in this way. Is it a good practice to connect all the decoupling capacitors in such a way or will I run into problems down the road?

An alternative way that I've seen being used is that there is a single trace for V_cc and another for GND that runs from the power source. The decoupling capacitors then 'tap' into those traces. I noticed that in that approach there was no ground plane – just thick V_cc and GND traces running from a single point. A bit like my V_cc approach described in the previous paragraph, but also adopted for GND.

Which approach would be better?

Figure 2

Figure 3

Here are some more pictures of the decoupling capacitors. I think out of these the best is the one where the capacitor is at the top layer – do you guys agree?

I'll obviously need one via for the GND pin if I want it to connect to the ground plane. Regarding the value, 0.001 uF to 0.1 uF was specified in Altera's documentation and so I settled at 0.01 uF. Unfortunately, even though I mentally noted that I'll need another capacitor at less 3 cm, I didn't remember to implement it on the schematic. Based on the suggestions here, I'll also add 1 uF capacitor in parallel to each Vdd/GND pair.

Regarding power – I'll be using 100 logic elements for a 100-bit shift register. The frequency of operation is largely dependent on the SPI interface of the MCU that I'll use to read the shift register. I'll be using the slowest frequency that the AVR Mega 128L allows for SPI (i.e. 62.5 kHz). The microcontroller will be at 8 MHz using its internal oscillator.

Reading the answers below, I'm now quite concerned about my ground plane. If I understand Olin's answer, I should not connect the GND pin of each capacitor to the ground plane. Instead, I should connect the GND pins to the main GND net on the top layer and then connect that GND network to the main return. Am I correct here?

If this is the case, should I have a ground plane at all? The only other chips on the board are an MCU and another CLPD (same device, though). Other than that, it's just a bunch of headers, connectors and passive elements.

Here's the CPLD with 1 uF capacitors and a star-network for V_cc. Does this look like a better design?

My worry now is that the star point (or area) will interfere with the ground plane, as they're on the same layer. Also note, I'm connecting V_cc to just the larger capacitors' V_cc pin. Is this good or should I connect V_cc to each capacitor individually?

Oh and please don't mind the illogical capacitor labeling. I'm going to fix it now.