integrated-circuit
My question is this one, how the firsts ic's were produced.
The first IC was produced by jack kilby: http://en.wikipedia.org/wiki/Jack_Kilby
Now exists advanced machines, that do all the work. From cutting the wafer to make the ic.
I would like to know what type of machines they used to fabricate the IC, what techniques they used, etc.
If someone could explain me i would be very grateful
Common practice is to use a ZIF adapter, aka programming socket adapter, test socket, etc, for the relevant IC form factor. For SOIC 16 through 24, for instance, this adapter ($13.99 on eBay) can be used:
Such ZIF sockets exist for several standard SMD IC formats.
The resin-like conducting strips used in LCDs are called elastomeric connectors, and are available in various pin pitches:
These can be purchased in long strips and cut up for use on a DIP adapter, but there don't seem to be any such adapters available on the sites I know of.
The three components above are Integrated Circuits, or more vulgarly chips. If you want to search them on Internet for each one, add the 'datasheet' word to the one in question (Can't see the numbers clearly, but they seem 4532, 4508, 4572).
All the other question you asked seem to be, to some extent, specific to a certain software that has been used to make these diagrams. If you don't know, try to know what software was used to do the job, and then get to its help/manual/documentation.
Best Answer
The first thing to realize is that the first integrated circuit was not a very complicated circuit. It maybe had one or two transistors, a few resistors, and a capacitor or two.
My evidence is a photo of the first IC at Wikipedia:
You can see there's only 4 or so contacts to the circuit. Kilby's 1959 patent also indicates this level of complexity, although several different "realizations" are shown and its not clear which of these was actually made first.
And using the microscope slide that the chip is mounted on for scale, you can estimate that the size of the components is likely in the millimeter scale, not the submicron scale of current ICs.
The patent does give some information on how the circuit was made:
This shows that the diffusion was done uniformly over the whole wafer. The Kilby patent also refers to a Bell System Technical Journal article from 1959 that gives more details on how individual transistors were fabricated at that time. Kilby would have done his diffusion steps using a reactor designed for manufacturing individual transistors.
Different devices were isolated from each other by etching through the diffusion layer. Given the scale of the devices, the photolithography steps to define the etched shapes could probably have been done with ordinary photographic equipment.