The first comprehensive logic series was the TTL series 74xx. This used BJTs (Bipolar Junction Transistors). Later there came variants like the often used 74LSxx, where the "LS" stands for Low-power Schottky TTL. As the name implies these used less power than the rather power-hungry TTL, and were faster too. At the same time the CMOS 4000 series was developed. The "C" in CMOS stands for Complementary, meaning it's a combination of N-channel and P-channel MOSFETs. Their construction is simpler than TTL and they use far less power. Later standard CMOS developed into HCMOS, "H" for High-speed. Most 74LSxx types have been released as HCMOS in the 74HCxx series, or the 74HCTxx series, which is TTL compatible. Later more variants were developed, like Advanced CMOS (74ACxx).
Microcontrollers are built in HCMOS technology, so they use MOSFETs. AFAIK JFETs aren't used for logic ICs. The transistor you show in the picture is a BJT, which you can tell from the pin designation:
E = Emitter
B = Base
C = Collector
For a MOSFET the pins would be
S = Source
G = Gate
D = Drain
respectively.
Many ICs in the 74HCxx series were originally released in 14 or 16 pin DIL packages, which meant that they would fit four 2-input gates. With miniaturization (SMT) came the demand for smaller packages, even if they contained less gates. Several manufacturers offer single-gate and dual-gate versions of logic gates. For example, NXP has a 74LVC1G00 (single 2-input NAND) and a 74LVC2G00 (dual 2-input NAND) version of the classical 74HC00. 74LVCxx is yet another HCMOS technology. This page lists all NXP logic families.
Metal film resistors work best for lower 1/f noise. 1/f noise arises through the interaction of the carriers with grain boundaries in the bulk material. A metal film is less likely to have distinct carrier disruptions at crystal boundaries (depending upon the allotype). However, metal film resistors can have inductance, depending upon how they are made and this may not work for you. Keep in mind that a 10 MOhm resistor may have significant Johnston noise.
Best Answer
These devices address burst, avalanche, flicker, and thermal noise.
Burst noise is the result of inconsistent ion deposition in the semiconductor fabrication process. It is reduced by escalating the selection/rejection criteria stringency, selling chips at different grades (eg: fast, slow); by changes in layout to better account for process variations; and by changes in the fab process itself to improve deposition homogeneity.
I think of Avalanche noise as amplified shot noise. Under reverse bias some electrons collide with the lattice in the PN junction depletion region with enough energy to form an electron-hole pair. Depending on the reverse bias voltage and junction characteristics, an avalanche breakdown may propagate, registering as a current spike. It is reduced by manufacturers by design and process changes to both increase the length of the depletion region (reduced field) and increase the energy required to free nearby electron-hole pairs.
Flicker noise, also called 1/f and pink noise, comes from "slow fluctuations of properties of ... materials"[1] during operation. As it is a sum of other sources of low frequency noise, it is addressed as these sources are identified.
Thermal noise is directly proportional to temperature, so any change that lowers local temperatures improves this figure. For example, changing die package for better dissipation; or layout changes to spread out local current hotspots.