In other words, How does the IC fabricator solder these thin wires between the die and the pads and guarantee that the soldering iron temp (300C for example) on the IC pads won't desolder them?
Electronic – How does soldering affect the internal bonding between the IC die and its package
integrated-circuitpcbsolderingtemperature
Related Topic
- Is it ideal to solder joins by placing the solder first on the component, and then having the soldering iron on top of it
- Electronic – For how long can one hold a soldering iron on a component pin when soldering
- Electronic – How to prevent the soldering tip oxidising while I’m using it
- Electronic – Probably overheated black color SMD pads
- Electronic – How To Repair Ripped Off Solder Pad On PCB
Best Answer
The bond wires are not soldered to the die. They are predominantly attached via a process called gold ball bonding. It uses gold bond wires, and welds them to a gold pad on the die using a combination of heat, pressure, and ultrasonic energy. Gold melts at a much higher temperature than any soldering process, making for a solid bond to the die.