Placing ground vias all over the PCB (stiching) to improve the EMI.
- Have all ground vias to be spaced the same distance? Or may they be separated different distances if it is under lambda/8?
I mean, I have to place ground vias all over the PCB edge to reduce EMI. The space between these ground vias are below lambda/20, around the edge. But the doubt comes from the ground vias which are not at the edge.
- Have these ground vias to maintain the same distance between them? How can I calculate the maximum number of them?
- Is there any rule of thumb to do it manually?
Best Answer
Step one: Show one solid proof that this helps in a predictable way. Not just some textbook, but real solid proof. And I can tell you: If that works and really does something measurably good in a predictable way, there will be plenty of solid science to back it.
Step two: Realize that it may not be worth your time.
PS: A good low impedance PDN (power distribution network) works in a predictable and measurable way. And so does other things like shielding. If done right.