Electronic – Reverse-Current Protection with p-Channel MOSFET

The use of a MOSFET for reverse voltage protection is very straight forward.
Some of your references are correct but of low relevance and are tending to make the problem look more complex than it is. The key requirements (which you have essentially already identified) are

• MOSFET must have enough Vds_max rating for maximum voltage applied

• MOSFET Ids_max rating more than ample

• Rdson as low as sensibly possible.

• Vgs_max not exceeded in final circuit.

• Power dissipation as installed able to sensibly handle operating power of I_operating^2 x Rdson_actual

• Power dissipation as installed able to handle turn on and off higher dissipation regions.

• Gate driven to cutoff "rapidly enough" in real world circuit.
  (Worst case - apply Vin correctly and then reverse Vin instantaneously. Is cutoff quick enough?)

In practice this is easily achieved in most cases.
Vin has little effect on operating dissipation.
Rdson needs to be rated for worst case liable to be experienced in practice. About 2 x headlined Rdson is usually safe OR examine data sheets carefully. Use worst case ratings - DO NOT use typical ratings.

Turn on may be slow if desired but note that dissipation needs to be allowed for.
Turn off under reverse polarity must be rapid to allow for sudden application of protection.

What is Iin max ?
You don't say what I_in_max is and this makes quite a difference in practice.

You cited:

"If the drain-to-source voltage is zero, the drain current also becomes zero regardless of gate–to-source voltage. This region is at the left side of the VGS– VGS(th)= VDS boundary line (VGS – VGS(th) > VDS > 0).

and

Even if the drain current is very large, in this region the power dissipation is maintained by minimizing VDS(on)."

Note that these are relatively independent thoughts by the writer. The first is essentially irrelevant to this application.
The second simply says that a low Rdson FET is a good idea.

You said:

Does this configuration fall under the VDS = 0 classification? That seems like a somewhat dangerous assumption to make in a noisy environment (this will be operating in the vicinity of various types of motors), as any voltage offsets between input supply ground and local ground could cause current to flow. Even with that possibility, I'm not sure I need to spec for my maximum load current on the drain current ID. It would then follow that I don't need to dissipate very much power either. I suppose I could mitigate the problem by Zener clamping VGS closer to VGS(th) to reduce drain current/voltage?

Too much thinking :-).

When Vin is OK get FET turned on asap.
Now Vds is as low as it is going to get and is set by Ids^2 x Rdson
Ids = your circuit current.
At 25C ambient Rds will start at value cited at 25C in spec sheet and will rise if/as FET heats. In most cases FET will not heat vastly.
eg 1 20 milliOhm FET at 1 amp gives 20 mW heating. Temperature rise is very low in any sensible pkg with minimal heatsinking. At 10A the dissipation = 10^2 x 0.020 = 2 Watts. This will need a DPAk or TO220 or SOT89 or better pkg and sensible heatsinking. Die temperature may be in 50-100C range and Rdson will increase over nominal 25C value. Worst case you may get say 40 milliOhm and 4 Watts. That is still easy enough to design for.

Added: Using the 6A max you subsequently provided.
PFet = I^2.R. R = P/i^2.
For 1 Watt disspation max you want Rdson = P/i^2 = 1/36 ~= 25 milliohm.
Very easily achieved.
At 10 milliohm P = I^2.R = 36 x 0.01 = 0.36W.
At 360 mW a TO220 will be warm but not hot with no heatsink but good airflow. A trace of flag heatsink will keep it happy.

The following are all under $1.40/1 & in stock at Digikey.

LFPACK 60V 90A 6.4 milliohm !!!!!!!!!!!

TO252 70V 90A 8 milliohm

TO220 60V 50A 8.1 milliohm

You said:

I suppose I could mitigate the problem by Zener clamping VGS closer to VGS(th) to reduce drain current/voltage?

No!
Best saved for last :-).
This is the exact opposite of what is required.
Your protector needs to have minimal impact on the controlled circuit.
The above has mjaximum impact and increases dissipation in protector over what can be achieved by using a sensibly low Rdson FET and turning it on hard.

The current can still flow through the "substrate" even though the channel is pinched. The reason why it saturates is that there will be a region of higher resistance of size proportional to the Drain-Source voltage, and therefore the resistance of this region will be proportional to the same voltage.

But as current is voltage/resistance, the dependence will cancel out and you'll get "constant" current.

From Wiki (emphasis mine):

Even though the conductive channel formed by gate-to-source voltage no longer connects source to drain during saturation mode, carriers are not blocked from flowing. Considering again an n-channel enhancement-mode device, a depletion region exists in the p-type body, surrounding the conductive channel and drain and source regions. The electrons which comprise the channel are free to move out of the channel through the depletion region if attracted to the drain by drain-to-source voltage. The depletion region is free of carriers and has a resistance similar to silicon. Any increase of the drain-to-source voltage will increase the distance from drain to the pinch-off point, increasing the resistance of the depletion region in proportion to the drain-to-source voltage applied. This proportional change causes the drain-to-source current to remain relatively fixed, independent of changes to the drain-to-source voltage, quite unlike its ohmic behavior in the linear mode of operation. Thus, in saturation mode, the FET behaves as a constant-current source rather than as a resistor, and can effectively be used as a voltage amplifier. In this case, the gate-to-source voltage determines the level of constant current through the channel.

Also, from the MOSFET operation description, under saturation:

Since the drain voltage is higher than the source voltage, the electrons spread out, and conduction is not through a narrow channel but through a broader, two- or three-dimensional current distribution extending away from the interface and deeper in the substrate. The onset of this region is also known as pinch-off to indicate the lack of channel region near the drain. Although the channel does not extend the full length of the device, the electric field between the drain and the channel is very high, and conduction continues.