Electronic – Why do surface mount mosfets have the heat sink pad on drain rather than source? (N channel)

heatsinkmosfetsurface-mount

On many surface mount power N-mosfets I have seen that the large pad is electrically the drain pad.

Wouldn't it make more sense to heat sink to the ground plane, where you probably already have a lot of copper? It seems like making the "heat sink pad" drain just increases the amount of total copper/used space on the board. Why design them so that you have to add an additional, or perhaps many, separate large fill(s) for heat?

Best Answer

For the same reason that bipolar transistors are heat-sinked through the collector. When the transistor is made, that's the big terminal on the back of the die. The source, or emitter in BJT's, is a mesh of little terminals interspersed with the gate or base terminals on the top of the die. It's simply the only practical terminal to connect to.