This is a very complex issue, since it deals with EMI/RFI, ESD, and safety stuff. As you've noticed, there are many ways do handle chassis and digital grounds-- everybody has an opinion and everybody thinks that the other people are wrong. Just so you know, they are all wrong and I'm right. Honest! :)
I've done it several ways, but the way that seems to work best for me is the same way that PC motherboards do it. Every mounting hole on the PCB connects signal gnd (a.k.a. digital ground) directly to the metal chassis through a screw and metal stand-off.
For connectors with a shield, that shield is connected to the metal chassis through as short of a connection as possible. Ideally the connector shield would be touching the chassis, otherwise there would be a mounting screw on the PCB as close to the connector as possible. The idea here is that any noise or static discharge would stay on the shield/chassis and never make it inside the box or onto the PCB. Sometimes that's not possible, so if it does make it to the PCB you want to get it off of the PCB as quickly as possible.
Let me make this clear: For a PCB with connectors, signal GND is connected to the metal case using mounting holes. Chassis GND is connected to the metal case using mounting holes. Chassis GND and Signal GND are NOT connected together on the PCB, but instead use the metal case for that connection.
The metal chassis is then eventually connected to the GND pin on the 3-prong AC power connector, NOT the neutral pin. There are more safety issues when we're talking about 2-prong AC power connectors-- and you'll have to look those up as I'm not as well versed in those regulations/laws.
Tie them together at a single point with a 0 Ohm resistor near the power supply
Don't do that. Doing this would assure that any noise on the cable has to travel THROUGH your circuit to get to GND. This could disrupt your circuit. The reason for the 0-Ohm resistor is because this doesn't always work and having the resistor there gives you an easy way to remove the connection or replace the resistor with a cap.
Tie them together with a single 0.01uF/2kV capacitor at near the power supply
Don't do that. This is a variation of the 0-ohm resistor thing. Same idea, but the thought is that the cap will allow AC signals to pass but not DC. Seems silly to me, as you want DC (or at least 60 Hz) signals to pass so that the circuit breaker will pop if there was a bad failure.
Tie them together with a 1M resistor and a 0.1uF capacitor in parallel
Don't do that. The problem with the previous "solution" is that the chassis is now floating, relative to GND, and could collect a charge enough to cause minor issues. The 1M ohm resistor is supposed to prevent that. Otherwise this is identical to the previous solution.
Short them together with a 0 Ohm resistor and a 0.1uF capacitor in parallel
Don't do that. If there is a 0 Ohm resistor, why bother with the cap? This is just a variation on the others, but with more things on the PCB to allow you to change things up until it works.
Tie them together with multiple 0.01uF capacitors in parallel near the I/O
Closer. Near the I/O is better than near the power connector, as noise wouldn't travel through the circuit. Multiple caps are used to reduce the impedance and to connect things where it counts. But this is not as good as what I do.
Short them together directly via the mounting holes on the PCB
As mentioned, I like this approach. Very low impedance, everywhere.
Tie them together with capacitors between digital GND and the mounting holes
Not as good as just shorting them together, since the impedance is higher and you're blocking DC.
Tie them together via multiple low inductance connections near the I/O connectors
Variations on the same thing. Might as well call the "multiple low inductance connections" things like "ground planes" and "mounting holes"
Leave them totally isolated (not connected together anywhere)
This is basically what is done when you don't have a metal chassis (like, an all plastic enclosure). This gets tricky and requires careful circuit design and PCB layout to do right, and still pass all EMI regulatory testing. It can be done, but as I said, it's tricky.
The designer has tried to indicate on the schematic the way the grounds should be separated, and done a reasonable job with the standard symbols available to him.
There ought to be a detailed description and written guidelines in the datasheet, and recommended PCB layouts either there, or in a separate Application Note (if you look up this chip on the TI website, the relevant App Notes should be easy to find)
But basically, the IC contains both a high gain amplifier with a sensitive input, and a high current switch, capable of generating a lot of noise. With incorrect grounding, high currents in the ground wires can generate unwanted signals on the amplifier input, causing instability or poor voltage regulation.
The solution is to - as far as practical - provide two separate grounds; one quiet one for sensitive signals (denoted by "earth ground" ) and one for high currents (denoted by chassis ground, which doesn't have to be connected to the actual chassis!) The two MUST be tied together - at one, carefully chosen point, sometimes called a "star earth" (useful search term for further reading!)
Thus R1 and R2 provide the voltage feedback to the error amplifier. You don't want to inject large errors via R2, so it is returned to the quiet ground. The error amplifier will take its reference from the "GND" pin (again on the quiet ground)
Now...
Switching current through L imposes a huge AC current waveform on Vin, and generates a huge AC current on Vout respectively. These currents are communicated to ground via C1 and C2 respectively.
In fact the power side of this circuit can be read as one continuous loop GND -> C1 -> L1 -> (switch inside chip between L and Vout) -> C2 -> GND.
This loop is the most important part of the circuit and must be kept as small as possible. Best thing to do is to put the GND leads of C1 and C2 right next to each other - virtually all the AC current goes from one C pin directly to the other. The other connections (PGND, VAUX via C3) are less important but go to this point too.
And one (reasonably thick) trace from here to the low noise ground will carry relatively little current, with relatively little noise on it.
Learning to read this high current path and keep it separate from low noise ground will go a long way to making your switchers trouble free.
Best Answer
Different grounds are a design choice. Depending on the expected currents and expected interference grounds are separated on chip and / or on PCB or even in a complete system (finished product). There are no rules to do it like this or like that to guarantee succes. A strategy is chosen at the design phase and that is implemented. Sometimes certain ground connections are prepared on a PCB and conmnected or left open in the final design depending on tests. Experienced engineers usually know which strategy to choose in a certain situation.
You worry too much about these things but have too little knowledge to understand why to choose which strategy. Why is this so important to you to understand this all now ? Some things require experience, this is one of them. Join a team with experienced engineers and learn from them.