I am new to electronics and am trying to wrap my head around the various tools used for producing various digital components.
My understanding of HDL languages like VHDL and Verilog is that they describe the behavior of chips/ICs and are ultimately used to fabricate FPGAs and ASICs.
My understanding of tools like Eagle CAD is that they are used for designing circuits like PCBs, motherboards, etc. So, say I am using a breadboard to design a circuit. Once I am satisfied with the way the breadboard is wired, I would then use Eagle CAD to model a PCB using the same wiring as my breadboard prototype, and Eagle CAD produces a file. I then hand that file to a PCB manufacturer, and they produce a nice, sleek PCB for me.
My first concern is this: are my assertions above correct? Is my understanding of these tools spot on, and if not, can someone please rectify or clarify anything for me?
Assuming I'm more or less correct:
What tools are used to design entire systems? Say I have a device that has:
- An custom ASIC chip/processor
- Flash memory chips
- EEPROM memory
- Peripherals (LEDs, servos, etc.)
- All of these connected via "motherboard"/PCB
I'd imagine HDL tools would be used to design the ASIC, and something like Eagle CAD would be used to produce the motherboard/PCB connecting everything, but what about the memory chips and peripherals? And are there any tools that design all of the above?
I ask because, ultimately, the entire system has to be integrated into a single PCB. That means a single manufacturer/assembler is ultimately responsible for putting all the parts together. So what I'm really getting at is: what types of files/specs are handed to a manufacturer to produce/assemble an entire system like the one above?
Best Answer
Everything you have written above that line is correct.
This is a multipart question. At the very top system level, you will find surprisingly heavy use of Word and Visio to produce a series of block diagrams. The different specialisations will then be handed off to different teams using individual tools.
Designing a whole new product out of new parts in one go with no prototypes is a risky endeavour. Generally you'd do it in stages: sort the custom ASIC out before finalising the motherboards.
RAM is highly structured and I think the tools for this may be proprietary things that just emit GDSII. Individual RAM cells can be simulated in SPICE.
The final question depends slightly on what you're making, but last time I did it I sent:
Injection moulded casework was designed in Solidworks and commissioned seperately. If you need things which can't be reflow soldered that involves extra explaining.