Wave soldering – using Pot solder

soldering

I understand the wave solder process for pin soldering, I have seen videos and read literature while pot solder is used for tinning purposes.

My question is about why we requires the solder to flow.

1- wetting process:
Q: why the wetting requires the solder flow in the Nozzle
q: why the nozzle full of solder but not flowing would not wet, based on wave flow needed?

Q: how could we use small pot to solder edge pins connector to pre-built board
without hand solder and without damage if I can get the hot solder in the nozzle in a small pot, but not flowing, but remains at the temperature during the soldering period?

or is that not possible without the flowing process in the nozzle?

Best Answer

To do dip soldering you first flux the board (for example by dipping it into liquid flux). There is no rush to solder after this, you can even let the flux dry. It helps if you can preheat the board to approximately 100°C.

The solder should be at the proper temperature before starting. Skim the dross to one side, leaving a shiny surface, then 'roll' the PCB into the solder starting at one end until it is flat in the solder, then lift the part up that was lowered first. Total time should be a few seconds. There will be much sizzling as the flux boils off. If the solder is too cool it won't clear the pins well. If it is too hot you can damage parts or the board itself.