I printed a board recently and, long story short, the pads aren't laid out correctly for two IC's: a SOIC8 MAX1771 and an 80-pin HV507. I moved all the pads from the top to the bottom layer, but forgot to flip the sides. Thus, along one side of the SOIC8 pads, for example, the connections number 4–1 instead of 1–4. I did something similar for the HV507. To give a better idea of the issue, if you pushed the IC through the board, then bent all of its pins upside-down, it would be connected correctly.
I can re-print the board, but I'd like to be able to test with the board that I have. That said, I've had difficulty finding a DIP adapter for the HV507. Is there any work-around for a reversed IC pinout that doesn't involve extensive new materials?
Best Answer
The 80QFP is thin enough that you may be able to place it upside down on the board, glue it in place, then carefully bend each pin down to its corresponding pad, and solder it. 80 pins is a lot to do that for though, this method is more commonly used on smaller chips.
I'm trying to find a good picture showing this technique.
At least, that's what I would do, just about any other method involving bodge wire (such as gluing it upside down and using wire to bring the pins down to the pads) or adapters will be very cumbersome with a package that size.