I've seen several boards that have ICs that look very similar to standard through-hole DIP packages (in particular, the packages have pins on 0.1" pitch), but the boards do not have any holes for the pins of those ICs.
Surface-mount components with 0.05" pitch are called "SOIC".
What is the standard name (or a popular name) for these components with 0.1" pitch that are intended to be surface-mounted?
(E.g., components such as the
Fairchild DF04S,
Shindengen S1ZB60-7072,
CEL PS2501AL-1-F3-A,
Toshiba TLP172G,
etc.)
I expected the datasheets for these components to mention some standard name — like datasheets for other components mention standard packages such as "TO-92", "DPAK", "TQFP", etc. — but I don't see one.
Is there a standard name (or a popular name analogous to "dead-bug construction") for the process of attaching standard through-hole DIP components to a board without holes?
(The process involves folding their leads one way or the other, gull-wing or J-lead).
Best Answer
SMDIP might be the generic term you're looking for - I've seen it used for opto couplers.: -
As for a standard name for the process of bending thru-hole leads to surface solder leads I can't help except to say maybe it's called "bend 'em with pliers"!