Electronic – Multiple Ground Planes

Ground planes in general are almost always a good thing, but if used incorrectly can actually hurt the quality of your board.

A typical board like you have here would have 1 layer dedicated to be a ground pour only with no traces running on it. However, it sounds like you are wanting to make your top layer have a ground pour so that you don't have to remove all of that extra copper. Doing a ground pour on a layer with a lot of traces is not really a ground plane at all, rather you can think of it as a ground trace with varying sizes running all around your board. It is hard to say if it will actually hurt the signal integrity of the design, but I can say for certain that it will not provide the same benefit that a ground plane will.

Typically when I see milled boards like this, the copper will be left unconnected on the unused areas of board. This provides a benefit of knowing that if you accidentally short one line to the unused copper, you don't get a hard short to ground that can kill some ICs. This can also be a negative though as accidentally shorting to a large unused piece of copper can turn into a nice antenna and pick up noise that you may have a hard time hunting the source of.

I realize my answer may not be a direct answer to what you are wanting to know, but it is very difficult to predict what configuration will be best for you. But, if it were my design, I would go ahead and just leave the extra copper on the board, but leave it disconnected from everything.

The layout you showed looks like what's called copper-backed coplanar waveguide (CBCPW). That means the ground return for the waveguide is not just in the coplanar grounds (the ground fills on the same layer as the signal traces) but also in the plane layer immediately "below" the signal layer. This structure is fairly esoteric, in the sense that I've only seen it used in digital systems when data rates exceed 20 Gb/s.

I found what looks like a reasonable discussion on the differences between CBCPW and microstrip in a Microwave Journal article by Rogers Corp engineers.

This article shows that the CBCPW has lower loss than microstrip at frequencies where radiation loss becomes important in the microstrip, roughly from 25 GHz and up, which explains why CBCPW is not widely used at lower frequencies.

Addressing your question, the article points out some special requirements for grounding vias in CBCPW structures:

For proper grounding, CBCPW circuits employ vias to connect the top-layer coplanar ground planes and the bottom-layer ground plane. The placement of these vias can be critical for achieving the desired impedance and loss characteristics, as well as for suppressing parasitic wave modes.

This basically means that without frequent stitching vias between the coplanar ground and the backing ground, power could be transferred to undesired propagation modes, which would cause either excess insertion loss or strong dispersion in the transmission line characteristics.