I'm working on a high power board that's using heavier (4oz) copper. I have an IC on this board in a 0.8mm pitch QFP-32 package (no other package options available). The IC's datasheet says the pin widths will be between 0.3mm and 0.45mm, and on the recommended footprint the pads are 0.45mm wide, which leaves 0.35mm (~13.8mil) between them. My PCB fab requires a minimum spacing of 15mil (0.381mm) for 4oz copper, so what I've done is decrease the pad widths to 0.4mm to satisfy this requirement. This leaves the possibility for a pin to be up to 0.05mm wider than its pad.
My question is if it is ok to do what I did, or can this cause assembly errors and/or other problems?