Considering a 6-Layer PCB with the layer sequence as below:
-What are the considerations that I should take care of when making drill pairs for VIAs?
-Is it possible to make a VIA starting from 1st layer to 3rd layer and also from 1st to 4th without any consideration? If not possible, what is the best way to connect these layers?
Generally, is there any suggestion for multilayer PCB drill pairs that is practically possible to fabricate and has the minimum limits for traveling between layers and also has the minimum impact on price increment?
I'm using Altium Designer and have BGA devices such as LPDDR3 RAM (if is important!).