In the begining of section 17.2 (chapter 17) of Digital Integrated Circuits: Analysis and Design the auther says:
There are positive and negative resists. The use of a positive resist
for pattern transfer is illustrated in Figure 17.1. First, a fresh
layer of silicon dioxide is grown over the entire wafer. Then, the
wafer is coated with a thin layer of positive photoresist. This
photoresist is spun on and then baked to the desired hardness.
I understand most of the text, but I cant't understand the meaning of "spun on".
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I found my answer in Wikipedia: