HP ML350 G4 – do the XEON processors need heat sink compound

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I pulled the heat sinks off a HP ML350 G4 and there appears to be no heat sink compound between the processor and the heat sink surfaces.

It looks like the point at which they make contact is actually metal on the processor which is a good conductor anyway.

Perhaps the compound is only needed when the processor has a ceramic top instead of a metal one? There was this very thin clearish, metalic looking film that wasn't so much a 'goo' as a separate kind of sheet.

Best Answer

"There was this very thin clearish, metalicish looking film that wasn't so much a 'goo' as a separate kind of sheet."

This is the thermal pad. Have a look at ProLiant ML350 Generation 4 Server Maintenance and Service Guide (PDF) page 26