integrated-circuitpackages
While ordering free samples from Maxim I have often seen components packaged as µMAX.
What is µMAX? When googling for it all I get are some Maxim components. If I look at google images I get an assortment of SMD and DIP package pictures that bear no resemblance to one another.
Is there a comprehensive list of component packages (cross-provider) around anywhere?
It's a (granted, fugly) TO-220 derived package used by Allegro for current measuring parts like the ACS756, datasheet. (I don't know if other manufacturers also use this kind of package.) The thick bent connections are for the current to be measured, in the case of the ACS756 up to 50A. This requires careful PCB layout (yes, the heavy pins are soldered in a PCB \$-\$ obviously not suited for paste-in-hole reflow, and hand-soldering will be tough as well :-))
Possibly other manufacturers prefer screw connections for low resistance current shunts like these ones from Isabellenhütte:
I don't know why Allegro prefers soldering over screw mounting.
I found this application, also based on an Allegro device (ACS715) which uses indeed screw connections.
What I find strange is that they pump 30 A through two ordinary SOIC pins. I would at least have replaced pins 1-2 and 3-4 by two tabs, I think. 15A through an SOIC pin seems like a lot.
Flip chip is about a single die. On the circuitry side solder balls are placed and the thing is mounted upside down on the PCB, hence the name.
Package on package (\$PoP\$) goes one step further: you have a flip chip, with another BGA on top of that, where the lower die occupies the place between the top die's solder balls.
The top die is not a flip chip; note the bonding wires. The bottom die is a flip chip, though the soldered balls aren't visible; the die should have been 1/10mm or so above its substrate.
Like many \$PoP\$ illustrations, this one shows a stacked die at the top, but that's not a requirement to talk about \$PoP\$.
A typical \$PoP\$ application would be to have a microcontroller below and a Flash or RAM device on top, since they will have to be tightly connected anyway.
Best Answer
Whereas most packages are used by several manufacturers, \$\mu\$MAX seems to be a package solely used by Maxim. It's an 8 pin SMT package, about as wide as an SO-8, but just 3mm long instead of the 5mm of an SO-8. This is achieved by using a 0.65mm pitch instead of 1.27mm.
Other manufacturers also go to ever smaller packages, but most often choose for leadless packages like DFN (Dual Flat No Leads).
Intersil has this list of packages.
NXP has this list.
Unfortunately my experience is that recommended footprints for a certain package aren't always consistent between manufacturers.