I am confuse with Package on package and Flip chip. Are they classified as multi-chip modules (MCM)?
Electronic – Package on package and Flip chip what is the difference
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Related Solutions
This picture can help to see the difference between BGA and WLP
Whereas most packages are used by several manufacturers, \$\mu\$MAX seems to be a package solely used by Maxim. It's an 8 pin SMT package, about as wide as an SO-8, but just 3mm long instead of the 5mm of an SO-8. This is achieved by using a 0.65mm pitch instead of 1.27mm.
Other manufacturers also go to ever smaller packages, but most often choose for leadless packages like DFN (Dual Flat No Leads).
Intersil has this list of packages.
NXP has this list.
Unfortunately my experience is that recommended footprints for a certain package aren't always consistent between manufacturers.
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Best Answer
Flip chip is about a single die. On the circuitry side solder balls are placed and the thing is mounted upside down on the PCB, hence the name.
Package on package (\$PoP\$) goes one step further: you have a flip chip, with another BGA on top of that, where the lower die occupies the place between the top die's solder balls.
The top die is not a flip chip; note the bonding wires. The bottom die is a flip chip, though the soldered balls aren't visible; the die should have been 1/10mm or so above its substrate.
Like many \$PoP\$ illustrations, this one shows a stacked die at the top, but that's not a requirement to talk about \$PoP\$.
A typical \$PoP\$ application would be to have a microcontroller below and a Flash or RAM device on top, since they will have to be tightly connected anyway.