Possibilities tried or considered:
- Split the package using wire cutters – sometimes works and sometimes doesn't
- Grind the top off with grinder – Some chips have no cavity between the die and the cap.
- Soak in MEK – I heard this works but haven't tried it.
Why would I want to do this? To photograph for forensics purposes – to look for damage or to get die numbers. I don't expect the part to function afterward. Electronic forensics labs seem to be able to open chips easily but I'm not sure what tools/techniques they use.