Electronic – this part in 556 die

Travis Goodspeed has the tutorial: http://travisgoodspeed.blogspot.com/2009/06/cold-labless-hno3-decapping-procedure.html Basically you put the part in a test tube with NO3 and swirl it around and leave it overnight until the encapsulation is dissolved.

Only slightly related, but look through Travis's Flickr stream for a lot of interesting dieshots.

Thats too bad, thankfully the solution is easy(ish)

1. Read the top of the other chips next to the blown one (I am optimistic that they are all the same)
2. Google the part number (typically the first/top line), and order a replacement (good sellers are digikey and mouser)
3. Clip the 2 legs of the blown component
4. Desolder the legs, be careful not to lift the pad!
5. Let the board cool for a bit
6. Desolder the component, again be careful not to lift the pad..
7. Let the board cool for a bit
8. Clear off the old solder with some solder wick.
9. Let the board cool for a bit
10. Solder the replacement on.

When desoldering, I like to heat up the component and then with my other hand, grab the component with tweezers. Sometimes, it actually helps to add solder to the part, if it is being especially stubborn. Always watch and make sure that you are not about to lift a pad.

In case the worse happens, and you lift a pad, use your eyes, and if needed a multimeter to find out where the trace on the board goes. Solder a wire from where the lifted pad was, to where the trace goes. Just pay attention to how much energy is flowing through the wire, and properly size the wire.