Chips, Wafers, and Dies – Understanding Their Relationship in Computers

computer-architectureintegrated-circuit

I have the following question:

If your demand is 50,000 RedDragon chips per month and 25,000
Phoenix chips per month, and your facility can fabricate 70 wafers a month, how
many wafers should you make of each chip?

Note: info about the die and such where given before and we calculated the amount of dies per wafer in a previous question, profit for each chip was calculated as well.

What they did is divide 50,000 and 25,000 per the amount of dies per wafer and got the amount of wafers needed I don't understand why.
From my understanding is that every chip is made of a wafer which has a lot of dies, if that is case case why don't we have 1 wafer for each chip, what am I getting wrong? Would appreciate you explaining the general picture and relationship between these three.

Best Answer

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Figure 1. One wafer - many dies. Image source: Computer Business Review.

From my understanding is that every chip is made of a wafer which has a lot of dies ...

No. Every chip is made from a die which is a small part of a large wafer.

2

Figure 1. An Intel 1702A EPROM, one of the earliest EPROM types, 256 by 8 bit. Here you can see the one die bonded to the lead frame of the "chip" package. Source: Wikipedia EPROM.

One wafer will make many dies. Generally one die will be used and packaged in each chip.